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| EMIF06-1502M12 IPADTM 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics Where EMI filtering in ESD sensitive equipment is required: 12 11 10 9 8 7 GND GND 1 2 3 4 5 6 LCD & CAMERA for Mobile phones Computers and printers Communication systems MCU Boards Micro QFN 2.5 mm x 1.5 mm (bottom view) Description The EMIF06-1502M12 is a 6 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the input pins. Pin configuration (top view) 1 Input 2 Input 3 Input 4 Input Output 12 Output 11 Output 10 Output 9 Output 8 Output 7 Benefits 5 Input 6 Input EMI asymmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 2.5 mm x 1.5 mm Very thin package: 0.6 mm max High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4). High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging. Lead free package Basic cell configuration Input 170 Output Typical line capacitance = 14 pF @ 2.5 V Complies with following standards: IEC 61000-4-2 level 4 input pins 15kV (air discharge) 8kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 (all pins) Order code Part number EMIF06-1502M12 Marking E TM: IPAD is a trademark of STMicroelectronics July 2006 Rev 2 www.st.com 1/9 Characteristics EMIF06-1502M12 1 Table 1. Symbol VPP Tj Top Tstg Characteristics Absolute ratings (limiting values at Tamb = 25 C unless otherwise specified) Parameter ESD discharge IEC 61000-4-2 air discharge on input pins ESD discharge IEC 61000-4-2 contact discharge on input pins Junction temperature Operating temperature range Storage temperature range Value 15 8 125 -40 to + 85 -55 to +150 Unit kV C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic resistance Peak pulse current Series resistance between Input & Output Input capacitance per line IPP VBR VCL VRM IRM IR VF V I IF Symbol VBR IRM RI/O Cline IR = 1 mA VRM = 3 V per line Tolerance 10% Test conditions Min. 6 Typ. 8 Max. 10 100 Unit V nA pF 153 170 14 187 VR= 2.5 V DC, VOSC = 30 mV, F = 1 MHz Figure 1. 0.00 S21(dB) attenuation measurement dB Figure 2. dB 0.00 -10.00 -20.00 Analog cross talk measurements -15.00 -30.00 -40.00 -50.00 -60.00 -30.00 -70.00 -80.00 F (Hz) -45.00 100.0k 1.0M 10.0M 100.0M 1.0G -90.00 -100.00 100.0k F (Hz) 1.0M 10.0M 100.0M 1.0G 2/9 EMIF06-1502M12 Ordering information scheme Figure 3. ESD response to IEC 61000-4-2 Figure 4. (+15 kV air discharge) on one input (Vin) and on one output (Vout) Vin ESD response to IEC 61000-4-2 (- 15 kV air discharge) on one input (Vin) and on one output (Vout) C1 = 10 V/d C1 = 10 V/d Vin Vout C2 = 5 V/d C2 = 5 V/d Vout 100 ns/d 100 ns/d Figure 5. Line capacitance versus reverse voltage applied (typical value) CLINE(pF) 24 22 20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 VLINE(V) 2.5 3.0 3.5 4.0 4.5 5.0 2 Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) Package Mx = Micro QFN x leads yy - xxx z Mx 3/9 Package information EMIF06-1502M12 3 Package information Table 3. QFN 2.5 x 1.5 package dimensions Dimensions Ref Millimeters MIN A A1 b D D2 E E2 e k L 0.20 0.25 0.30 0.35 0.30 1.70 0.50 0.00 0.15 TYP 0.55 0.02 0.18 2.50 1.80 1.50 0.40 0.40 0.08 0.10 0.12 0.14 0.50 0.12 1.90 0.67 MAX 0.60 0.05 0.25 MIN 0.20 0.00 0.06 inches TYP 0.22 0.01 0.07 0.98 0.71 0.59 0.16 0.16 0.24 0.75 MAX 0.24 0.02 0.10 Figure 6. Footprint Figure 7. Marking Dot: Pin 1 Identification X = Marking YWW= Data code (Y=year WW= week XY ww 4/9 EMIF06-1502M12 Figure 8. Tape and reel specification 2.0+/-0.05 4.00+/-0.1 f 1.5 +/- 0.1 Package information 1.75 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.05 3.5 +/- 0.05 0.75 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8.1 +/- 0.1 8.1 +/- 0.1 XY ww XY ww XY ww 2.70 2.70 1.70 User direction of unreeling 4.00 5/9 Recommendation on PCB assembly EMIF06-1502M12 4 4.1 Recommendation on PCB assembly Stencil opening design 1. General recommendation on stencil opening design a) Stencil Opening Dimensions: L (Length), W (Width), T (Thickness). L T W b) General Design Rule Stencil thickness (T) = 75 ~ 125 m W Aspect Ratio = ---- 1.5 T Lx W Aspect Area = --------------------------- 0.66 2T ( L + W ) 2. Reference design a) b) Stencil opening thickness: 100 m Stencil opening for central exposed pad: Opening to footprint ratio is 50%. Example: Stencil opening L = 1224 m, W = 300 m, Footprint (see Figure 6.) L = 1800 m, W = 400 m. c) Stencil opening for leads: Opening to footprint ratio is 90%. Example: Stencil opening L = 570 m, W = 190 m, Footprint (see Figure 6.) L = 600 m, W = 200 m. 4.2 Solder paste 1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 4.3 Placement 1. 2. 3. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 6/9 EMIF06-1502M12 4. Recommendation on PCB assembly 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5. 6. 4.4 PCB design preference 1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 Reflow profile Temp. Peak Temp. Liquidus Temp. time Pre-heating zone Soaking zone Reflow Cool Down zone zone Tin-lead Alloy Parameters [SnPb - SnPbAg] Pre-heating rate Soaking temp. Soaking time Peak temperature Reflow time above liquidus Cool down rate 2.5 C/s 120-180 C 80-120 s 210-240 C 40-80 s < 6 C/s Lead-Free Alloy [SnAgCu] 2.5 C/s 140-180 C 80-180 s 245-260 C 40-140 s < 6 C/s Note: Minimize air convection currents in the reflow oven to avoid component movement. 7/9 Ordering information EMIF06-1502M12 5 Ordering information Part number EMIF06-1502M12 Marking E Package Micro QFN Weight 6 mg Base qty 3000 Delivery mode Tape and reel (7") 6 Revision history Date 12-Dec-2005 3-Jul-2006 Revision 1 2 Initial release. Reformatted to current standard. Changed Figure 1 to show improved results. Changes 8/9 EMIF06-1502M12 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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